IDTechEx

Materials Informatics: The Data Revolution and AI Boom come to Materials R&D Date: Thursday 21 March 2024 Presenter: Sam Dale, Senior Technology Analyst at IDTechEx Space is limited - book your seat today! Materials informatics (MI) involves using data-centric approaches, including AI and machine learning, to accelerate materials R&D and take it in new directions. The effects of this fundamental change in how materials R&D proceeds have been significant, with a growing number of success stories and attention further focused by the ongoing AI boom. By combining well-designed data infrastructures with advanced optimization and statistical tools, scientists and engineers can design new materials, discover materials for a given application, or fine-tune of how materials are processed. There is no one-size-fits-all approach and a growing number of strategies have evolved. The competitive benefits felt by adopters are set to be significant. In this webinar, IDTechEx will give a comprehensive overview of this field. This is based on extensive primary interviews across the industry and draws on information from their leading technical report on this topic - "Materials Informatics 2024-2034: Markets, Strategies, Players", marking the fourth year of IDTechEx's coverage of this field. This webinar will provide: The latest commercial developments in the field, including the impact of new industry interest in the age of AI Assessment of the different strategic approaches being adopted The key technology pillars required for a MI approach Industry pain points Application case studies

Electrification of cars is well under way, and whilst the market still faces challenges for greater adoption worldwide, it is now a common experience to see electric cars on the road. However, multiple other vehicle segments need to electrify to meet emissions targets, or reduce cost of ownership. Many of these are at earlier stages of electrification with significant challenges requiring greater economic, regulatory, and technological drivers. This webinar, based on IDTechEx's latest report on 'Electric Vehicles: Land, Sea, and Air 2024-2044' (www.IDTechEx.com/EV), will cover the current status, drivers, and future expectations for electrification of sectors including: - Cars - Light commercial vehicles - Trucks - Buses - Boats and ships - Trains - Air Taxis (eVTOL)

The slowing of Moore's law and the rising development and manufacturing cost of monolithic Si IC are the two primary reasons why developing advanced semiconductor packaging technologies is crucial right now. In comparison to conventional packaging technologies, advanced semiconductor packaging technologies, such as 2.5D and 3D, promise high bandwidth and low signal latency interconnect, enabling the IC vendor to continue to supply high-performance chips at a reasonable price. Currently, several high-end commercial products have already used 2.5D and 3D advanced semiconductor packaging technologies. Nevertheless, numerous development initiatives are currently underway to further improve the performance of such devices and expand the package size to accommodate additional components. Ultimately, the goal is to have a completely 3D integration where many logic ICs and memory are physically placed on top of one another. However, the road is by no means simple. Thermal management and manufacturing face several problems that have yet to be overcome. In this webinar, Dr. Yu-Han Chang, a Senior Technology Analyst, will present IDTechEx's latest data and prospects for the advanced semiconductor packaging industry, which will include research from IDTechEx's advanced semiconductor packaging market research portfolio. This webinar will provide an overview of the current state of the advanced semiconductor packaging industry, and the content include: - Advanced semiconductor packaging markets and their mid-long-term opportunity - Player analysis - the dynamics of advanced semiconductor packaging battleground - Industry barriers: Manufacturing challenges and material requirements - Research direction for Advanced Semiconductor Packaging

3D printing in 2023: what a year it has been in the world of additive manufacturing! Major events have rocked the 3D printing industry, with all eyes on the biggest 3D printer manufacturers to see their next steps. At the same time, important brands like Apple continue to explore 3D printing for their latest products like the Apple Watch, at least in part driven by continued supply chain disruptions and other economic changes. With manufacturers across industries, from consumer goods to automotive to electronics and more, looking to develop more resilient supply chains and logistics, 3D printing is now positioning itself to capitalize on the need for manufacturing agility and flexibility. That said, challenges remain for the additive manufacturing industry to push adoption even further into high value verticals. To understand the market forces impacting IDTechEx's 2024 outlook for 3D printing, this webinar will examine the financial and technical announcements that shook the industry in 2023, such as acquisitions, SPACs, mergers, etc. Information from these market movements, conference observations, and IDTechEx's company interviews from 2023 will be synthesized to identify 3D printing's key takeaways moving into 2024. In this webinar, IDTechEx will: - Analyze financial activity in 2023 within the AM industry - Identify AM industry trends and challenges from 2023 and predict future 2024 industry moves - Present IDTechEx's 2024 takeaways for the 3D Printing market This webinar is based on IDTechEx's 3D printing research portfolio, which has explored the technology, materials, and economic trends of the additive manufacturing industry since 2014.

IDTechEx's new report "Automotive Radar 2024-2044: Forecasts, Technologies, Applications" finds that approximately 70% of vehicles 2022 had a front radar, and around 30% use side radars for blind spot detection. This webinar explores some of the development avenues that are being explored to address the ever-growing demands of radar.